Fan-Out Panel-Level Packaging (FOPLP) Solution
Higher integration, lower cost, excellent thermal performance
Product Description
Technical Advantages
- 50% improvement in integration density
- 30% cost reduction
- Excellent thermal dissipation performance
Application Areas
- High-performance computing chips
- AI processors
- 5G communication chips
Product Overview
Our industrial abrasive products are widely used in metal processing, automotive manufacturing, aerospace and other fields. Fan-Out Panel-Level Packaging (FOPLP) Solution is manufactured with high-quality abrasives and advanced processes to ensure cutting efficiency and service life. Products are certified under ISO 9001 quality management system and complies with EN 12413 safety standards.
Technical Advantages
- 30% faster cutting speed with high-density abrasive formula
- Service life up to 120 minutes, 20% better than industry standard
- EN 12413 certified, maximum linear speed 80m/s
- Wide material compatibility: stainless steel, carbon steel, aluminum alloy
Application Scenarios
- Automotive: body weld grinding, precision finishing of parts
- Shipbuilding: steel plate cutting, weld treatment
- Mechanical processing: mold trimming, deburring of parts
