Innovating Across Industries, Delivering Global Value
A diversified technology group specializing in industrial solutions, renewable energy, advanced packaging, and precision manufacturing
Business Segments
Six core business areas to meet your needs comprehensively
Industrial Abrasives
High-precision industrial abrasive solutions widely used in metal processing, automotive manufacturing and other fields
Solar Cells
High-efficiency solar cells to support global clean energy transition
FOPLP Packaging
Fan-Out Panel-Level Packaging technology with higher integration and lower cost than traditional packaging
Cosmetics Factory
Professional cosmetics OEM/ODM services to create international beauty brands
Product Packaging
Custom packaging design and production to enhance product value
Metering Pumps
Precision metering pump products suitable for chemical, pharmaceutical and other industries
Trusted Brands We Supply
Direct supply chain from official brands and authorized distributors
Our Strength
Certifications
Multiple international authoritative certifications, quality guaranteed
About Mengda Technology
Hong Kong Mengda Technology Co., Ltd., established in 2010, is a diversified technology group specializing in six business areas: industrial abrasives, solar cells, FOPLP packaging, cosmetics manufacturing, product packaging, and metering pumps. After 15 years of development, we have served customers in 50+ countries worldwide, with an annual production capacity exceeding 10 million units.
Headquartered in Hong Kong with production base and office in Shanghai, we hold ISO 9001, ISO 14001, ISO 45001 quality management system certifications. Our products are certified by CE, RoHS, FDA, GMP, and BSCI.
Our core advantages include: cross-industry technology integration, quick response service capability, and one-stop solution provision. We provide complete production chain services to help customers reduce procurement costs and shorten delivery cycles.
Mengda Technology is familiar with international trade rules and export processes, providing long-term stable service to overseas customers. Whether small batch customization or large-scale production, we can meet your needs.
Technology Highlights
Focusing on high-tech businesses with proven technical capabilities
FOPLP Packaging Technology
Fan-Out Panel-Level Packaging (FOPLP) is a new generation semiconductor packaging technology. Compared with traditional packaging, it has higher integration, lower cost and better heat dissipation performance. Our FOPLP technology has been widely used in high-performance computing, AI chips and other fields.
- Higher integration, saving 50% space
- Excellent heat dissipation, extending chip life
- 30% cost reduction, better cost performance