Hong Kong Mengda Technology Co., Ltd.

Products

Diversified product portfolio to meet global customer needs

Industrial Abrasives

FOPLP Packaging

Product Packaging

FOPLP 扇出型面板级封装

新一代 3D 异构集成技术，带宽提升 5 倍

FOPLP 扇出型封装方案

更高集成度、更低成本、优异散热性能